Navitas Brand Guidelines: GaNFast Chargers, a 2021 SPAC Listing & GeneSiC

A gallium-nitride start-up and the phone charger.

Navitas Semiconductor was founded in 2014, according to the company and the trade journal Semiconductor Today, which in October 2021 described it as based in El Segundo, California, and Dublin, Ireland. Its co-founders, the journal reported, were Gene Sheridan, the chief executive; Dan Kinzer, chief operating and technology officer; Nick Fichtenbaum, vice-president of engineering; and Jason Zhang, vice-president of applications and technical marketing — all still with the company when it listed its shares in 2021.

The company built its name on gallium nitride, or GaN, a semiconductor material used in power electronics as an alternative to silicon. Navitas says it introduced the first commercial GaN power integrated circuits. Its GaNFast chips, Semiconductor Today explained in 2021, put GaN power transistors together with GaN drive, control and protection circuits in a single surface-mount package.

The first big market was the compact phone and laptop charger. By October 2021, the company said, GaNFast chips were used in more than 130 mobile chargers, including fast chargers from Xiaomi, Dell, Lenovo and Anker, and more than 30 million had been shipped. Those are the company’s own figures, as reported by the trade press at the time.

In its own material Navitas still dates its work on GaN power chips to 2014. In a release of 1 September 2026 it said it held more than 300 issued and pending patents across its GaN and silicon-carbide technologies.

A SPAC, a Nasdaq bell and a silicon-carbide pioneer.

Navitas became a public company through a merger with a special-purpose acquisition company, Live Oak Acquisition Corp II. Live Oak II’s stockholders approved the deal on 12 October 2021, and Navitas’s shares and warrants began trading on the Nasdaq Global Market on 20 October 2021, under the symbol NVTS, Semiconductor Today reported, with Gene Sheridan ringing the opening bell in New York after what the journal called seven years as a start-up.

The second step was silicon carbide, or SiC, another wide-bandgap material used for higher-voltage power devices. On 15 August 2022 Navitas announced that it had acquired GeneSiC Semiconductor, which its release, filed with the US Securities and Exchange Commission, called a silicon-carbide pioneer. GeneSiC’s president, Dr. Ranbir Singh, joined Navitas as executive vice-president for the GeneSiC business, and GeneSiC remains the name of the company’s silicon-carbide line.

With the two brands, GaNFast for gallium nitride and GeneSiC for silicon carbide, Navitas describes itself as a pure-play wide-bandgap power company. In October 2025 Semiconductor Today reported that it was developing GaN and SiC devices for the 800-volt direct-current power architecture that NVIDIA had announced for AI data centres, in which power is converted from the grid to 800 volts DC near the data hall and then stepped down in two stages before it reaches the processors, and in 2026 the company named AI infrastructure, performance computing and industrial electrification among its target markets.

Industry context.

Analog and power chipmakers sell parts that most people never see. Their products sit inside chargers, cars, motor drives and power supplies, usually as small black packages soldered to a board, so the industry’s visual language has to make something tiny and hidden look solid and precise. The usual answer is the macro photograph: a packaged chip or a power module shot close up against a dark or plain ground, its leads and markings sharp and its edges lit like an object in a catalogue.

Materials are the second subject. Makers that work with silicon carbide tend to show the wafer itself, a thin disc that often looks faintly green or amber under studio light, while gallium-nitride and silicon makers show wafers patterned with rows of dies. These images stand in for the factory, which tends to appear as clean-room suits and wafer carriers rather than as a building.

The third subject is the application. Power-chip makers lean heavily on electric-car chargers, inverters, solar installations and data-centre racks, because those are where their parts do visible work. Closer to the engineer, the pictures shift to evaluation boards on lab benches, probes and cables, and oscilloscope traces showing a clean switching edge — an image that speaks to the people who will design the chip in.

Trade shows complete the picture. Europe’s electronica in Munich and PCIM in Nuremberg, and APEC in the United States, are where many of these companies set out their stands, demonstration boards and new packages each year. In each of these settings the hardware and the technical data are meant to carry the message, with the brand kept to a name on the stand and the board.

A new chief executive, a Vermont foundry and the AI data centre.

The co-founder era at the top ended in 2025. On 26 August 2025 Semiconductor Today reported that Navitas, by then based in Torrance, California, had appointed Chris Allexandre president and chief executive from 1 September, succeeding Gene Sheridan, who stepped down as chief executive and board member on 31 August after 11 years. Allexandre came from Renesas, where he had led the power division since October 2023 and, the journal noted, oversaw the integration of the GaN company Transphorm after Renesas bought it in June 2024; before that he had been Renesas’s chief sales and marketing officer from 2019 to 2023, and earlier held senior roles at Integrated Device Technology and NXP.

Under him the company has used the label “Navitas 2.0.” On 25 August 2026 it announced the purchase of Claros, a developer of integrated voltage regulators for AI processors, and on 7 October 2026 Semiconductor Today reported that the acquisition was complete, describing Claros’s technology as one that combines power transistors, digital control, inductors and capacitors in a single regulator placed close to the processor; Navitas says the deal extends its range from the power grid all the way to the processors in AI servers.

Where the chips are made has also changed. In November 2025 Navitas and the foundry GlobalFoundries announced a long-term partnership, and in a release of 1 September 2026, published by EEJournal, Navitas said its fifth-generation GaNFast parts had been developed for production at GlobalFoundries’ 200-millimetre GaN-on-silicon fab in Burlington, Vermont, with first shipments due that month. The company presents that as US manufacturing for AI infrastructure and other markets.

The brand has two product names doing most of the work: GaNFast, which came first and is tied to the charger story, and GeneSiC, the silicon-carbide line it bought in 2022. The company name sits above both, on Nasdaq under NVTS.

For a design guide, Navitas shows how a young chip company can build a recognisable product name around a material — GaN — before the company name itself is widely known. Compare Wolfspeed, a silicon-carbide specialist, and Renesas, where its chief executive previously ran the power business. For this guide we use an indigo, a gold and a cool white with a sans, an unofficial interpretation; no product or logo is reproduced.

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