JCET Brand Guidelines: A 1972 Jiangyin Transistor Factory, STATS ChipPAC & China Resources

A transistor factory on the way to back-end manufacturing.

JCET dates its story to 1972, when the Jiangyin Transistor Factory was set up in Jiangyin, in Jiangsu province, according to the milestone list on the company’s own site. The same list marks 1989 as the year its first automated integrated-circuit assembly line started production, and 2000 as the year the factory was restructured as JCET. In 2003 the company listed on the Shanghai Stock Exchange, and in the same year it set up a unit it calls JCAP. Its Chinese legal name, 江苏长电科技股份有限公司, is the source of the initials; TrendForce News, writing in November 2024, gives the English form as Changjiang Electronics Technology.

The company now calls itself a provider of integrated-circuit back-end manufacturing and technology services. That means the work that happens after a chip is made on a silicon wafer: JCET lists package integration design, wafer probing, bumping, assembly, final testing and drop shipment to customers around the world. TrendForce News describes advanced packaging as the last stage of chip production, in which individual dies are assembled into a complete product. Companies that do this work for chip designers and chipmakers are known in the trade as outsourced semiconductor assembly and test firms, or OSATs.

Growth came through new sites in China before it came from abroad. The milestone list records JCET D8 in Suqian, Jiangsu, established in 2011, and JCET D9 in Chuzhou, in neighbouring Anhui province, in 2012. Both appear on the company’s list of worldwide locations today, alongside the home base in Jiangyin, where a newer unit, JCET Microelectronics, began operations in 2024.

The initials can mislead. “JCET” is also the abbreviation for Joint Combined Exchange Training, a United States military training programme, and the two share a disambiguation page on English Wikipedia; the packaging company has no link to it.

STATS ChipPAC, SMIC and China Resources.

The step that turned JCET into a group with plants outside China came in 2015. A Singapore subsidiary, JCET-SC (Singapore), made a voluntary conditional general offer for STATS ChipPAC, the packaging and test company listed on the Singapore Exchange, with an offer document sent to shareholders on 16 July 2015. On 15 October 2015 the offeror’s financial advisers announced that the compulsory acquisition of the remaining shares was complete: STATS ChipPAC had become a wholly owned subsidiary, with JCET named as the ultimate parent, and would be delisted from the Singapore Exchange. JCET’s own milestone list sums up the year in four words: “JCET Acquired STATS ChipPAC.”

The STATS ChipPAC name lives on inside the group. JCET’s list of worldwide locations shows STATS ChipPAC Korea at two sites in Incheon and STATS ChipPAC Singapore in Yishun, and the company says it runs research and development centres in China and Korea and manufacturing in China, Korea and Singapore.

Ownership shifted again in the years that followed. TrendForce News, citing the South China Morning Post in November 2024, reported that a subsidiary of SMIC, the Chinese foundry, had been a shareholder and that a former SMIC chairman had joined JCET’s board in 2017 and later chaired it. In 2024 the state-owned China Resources Group bought about 22.5% of JCET through a Hong Kong subsidiary, taking shares from the China Integrated Circuit Industry Investment Fund, known as the “Big Fund,” and from the SMIC subsidiary, and became the largest shareholder; the Big Fund kept 3.5%, and the SMIC unit no longer held any shares, the report said. The chairman and two other board members stepped down. JCET’s milestone list records the same year as the one in which China Resources became its actual controller.

The group also grew in memory. MT Newswires reported in October 2024 that JCET had completed the purchase of an 80% stake in SanDisk Semiconductor on 28 September 2024; JCET lists SanDisk Semiconductor Shanghai, in the city’s Minhang district, among its plants. In 2025, the company says, a JCET automotive electronics factory began operations, and its locations page places JCET Shanghai Automotive in the Lingang New Area of Shanghai.

How packaging and test companies present themselves.

Chip packaging and test companies sit between the chipmaker and the finished device. The trade calls them OSATs, for outsourced semiconductor assembly and test: they take silicon made by others, mount it, connect it, seal it and check that it works. Their customers are other technology companies, so they rarely speak to the public, and their imagery is built for engineers, buyers and investors.

That imagery leans on close-ups. Company pages and annual reports return again and again to macro shots of packaged chips and the substrates beneath them, to fine arcs of gold or copper wire bonds linking a die to its frame, and to wafers catching the light. Methods carry the names that a consumer brand would give to products: flip chip, fan-out, system in package, 2.5D and chiplet packaging.

The second register is the factory. Rows of test handlers, operators in white cleanroom suits, and long, low factory campuses in places such as Kaohsiung, Penang and Jiangsu stand for scale and reliability. Plants are often known by codes and numbers rather than names, and maps of sites across Asia, Europe and the Americas do much of the storytelling. Trade shows such as SEMICON are where these companies meet their customers face to face.

This guide sets out what can be checked about each company — who founded it, who owns it, where it works and what its record shows — and marks clearly what rests only on the company’s own word. The palettes and type here are our own interpretation, not the companies’ marks.

Chiplets, wire bonds and a mission statement.

JCET describes a broad range of packaging. At the established end it lists wire bonding, flip chip, wafer bumping and wafer-level packaging; at the newer end it lists System-in-Package and 2.5D and 3D packaging, and it names the uses as automotive, artificial intelligence, high-performance computing, storage, communication, smart devices, industrial and medical work, and power and energy. TrendForce News called JCET a leading company in China for advanced packaging, including 2.5D and 3D configurations, in November 2024.

The company’s chiplet work carries its own trademark. JCET says XDFOI® is its technology platform for chiplet-based heterogeneous integration, combining package design with process optimisation to bring different dies together in one package. Its 2.5D options, the company says, include silicon interposers, silicon bridges and organic RDL interposers, and it also offers 3D vertical stacking and the package-level integration of optical and electronic devices.

The corporate language is formal and short. JCET’s stated mission is “to provide advanced and reliable integrated circuit back-end manufacturing technology and services for a smarter world,” and its vision is to be a world-class integrated-circuit manufacturing and technology services provider. Its listed values are customer focus, respect and diversity, initiative and integrity, and alignment and synergy, and its culture page adds four short phrases: win-win collaboration, keeping commitments, respecting talent and taking responsibility. The locations page names the management-system standards each plant holds, among them ISO 9001 and the automotive standard IATF 16949.

For a design guide, JCET shows how a packaging group with roots in a provincial transistor factory now presents itself through plants, standards and named technology platforms rather than through consumer products. Compare Amkor and ASE Technology, two other packaging and test groups. For this guide we use a deep blue, a cool silicon grey and a copper accent with a sans, an unofficial interpretation; no product or logo is reproduced.

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